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Home › IEEE Electrical Design of Advanced Packaging and Systems Symposium

IEEE Electrical Design of Advanced Packaging and Systems Symposium

Conference and proceedings
Country
United States
Northern America
Subject Area and Category
Computer Science
└ Automotive Engineering
└ Computer Science (miscellaneous)
└ Control and Systems Engineering
SJR 2025
0.194
SJR Score
H-Index
8
Citations / Doc (2yr)
0.62
Total Citations (3yr)
78
Publication type
Conference and proceedingss
ISSN
21511225, 21511233
Coverage
2019-2024
Journal Rank
#22,337
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Subject Categories

Automotive Engineering
Computer Science (miscellaneous)
Control and Systems Engineering
Electrical and Electronic Engineering

Detailed Metrics

Total Docs. (3 years) 123
Total Citations (3 years) 78
Citable Docs. (3 years) 119
Citations / Doc. (2 years) 0.62

Metrics Visualization

Latest year data vs 3-year cumulative figures

Publication & Citation Trend

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Top 10 Most Cited Articles

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Frequently Asked Questions

What is the impact factor of IEEE Electrical Design of Advanced Packaging and Systems Symposium?

The official Journal Impact Factor (JIF) is published by Clarivate in the Journal Citation Reports (JCR) and is not listed on this page. Based on SCImago data, IEEE Electrical Design of Advanced Packaging and Systems Symposium has an SJR of 0.194.

What is the SJR and quartile of IEEE Electrical Design of Advanced Packaging and Systems Symposium?

IEEE Electrical Design of Advanced Packaging and Systems Symposium has an SJR (SCImago Journal Rank) of 0.194.

What is the H-index of IEEE Electrical Design of Advanced Packaging and Systems Symposium?

The H-index of IEEE Electrical Design of Advanced Packaging and Systems Symposium is 8, meaning 8 of its articles have each been cited at least 8 times.

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Journal Information

SJR0.194
H Index8
ISSN21511225, 21511233
PublisherInstitute of Electrical and Electronics Engineers Inc.
CountryUnited States
RegionNorthern America
Coverage2019-2024
Open AccessNo
TypeConference and proceedings
Rank#22,337

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