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Home › IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings

Conference and proceedings
Country
United States
Northern America
Subject Area and Category
Computer Science
└ Artificial Intelligence
└ Control and Optimization
└ Electrical and Electronic Engineering
SJR 2025
0.134
SJR Score
H-Index
3
Citations / Doc (2yr)
0.33
Total Docs. (latest)
93
Total Citations (3yr)
60
Publication type
Conference and proceedingss
ISSN
26427036, 2641287X
Coverage
2023-2024
Journal Rank
#26,753
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Subject Categories

Artificial Intelligence
Control and Optimization
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Safety, Risk, Reliability and Quality

Detailed Metrics

Total Docs. (latest) 93
Total Docs. (3 years) 180
Total Refs. 1,269
Total Citations (3 years) 60
Citable Docs. (3 years) 176
Citations / Doc. (2 years) 0.33
Ref. / Doc. 13.65
% Female 25.1%

Metrics Visualization

Latest year data vs 3-year cumulative figures

Publication & Citation Trend

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Top 10 Most Cited Articles

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Frequently Asked Questions

What is the impact factor of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings?

The official Journal Impact Factor (JIF) is published by Clarivate in the Journal Citation Reports (JCR) and is not listed on this page. Based on SCImago data, IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings has an SJR of 0.134.

What is the SJR and quartile of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings?

IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings has an SJR (SCImago Journal Rank) of 0.134.

What is the H-index of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings?

The H-index of IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings is 3, meaning 3 of its articles have each been cited at least 3 times.

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Journal Information

SJR0.134
H Index3
ISSN26427036, 2641287X
PublisherInstitute of Electrical and Electronics Engineers Inc.
CountryUnited States
RegionNorthern America
Coverage2023-2024
Open AccessNo
TypeConference and proceedings
Rank#26,753

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