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Home Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Conference and proceedings
Country
United States
Northern America
Subject Area and Category
Computer Science
Control and Systems Engineering
Electrical and Electronic Engineering
Hardware and Architecture
SJR 2025
0.165
SJR Score
H-Index
15
Citations / Doc (2yr)
0.32
Total Docs. (latest)
128
Total Citations (3yr)
86
Publication type
Conference and proceedingss
ISSN
21505942, 21505934
Coverage
2011-2013, 2016-2024
Journal Rank
#24,298

Subject Categories

Control and Systems Engineering
Electrical and Electronic Engineering
Hardware and Architecture

Detailed Metrics

Total Docs. (latest) 128
Total Docs. (3 years) 263
Total Refs. 977
Total Citations (3 years) 86
Citable Docs. (3 years) 245
Citations / Doc. (2 years) 0.32
Ref. / Doc. 7.63
% Female 25.6%

Metrics Visualization

Latest year data vs 3-year cumulative figures

Publication & Citation Trend

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Journal Information

SJR0.165
H Index15
ISSN21505942, 21505934
PublisherIEEE Computer Society
CountryUnited States
RegionNorthern America
Coverage2011-2013, 2016-2024
Open AccessNo
TypeConference and proceedings
Rank#24,298

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