Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP
Scopus Active
Journal
Country
United States
Northern America
Subject Area and Category
Engineering
└
Control and Optimization
└
Electrical and Electronic Engineering
└
Electronic, Optical and Magnetic Materials
SJR 2025
N/A
H-Index
1
Total Docs. (latest)
24
Publication type
Journals
ISSN
28368487, 27681874
Coverage
2025
Journal Rank
#32,085
Subject Categories
Control and Optimization
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Safety, Risk, Reliability and Quality
Subject Areas
Detailed Metrics
| Total Docs. (latest) | 24 |
| Total Refs. | 280 |
| Ref. / Doc. | 11.67 |
| % Female | 24.5% |
Metrics Visualization
Latest year data vs 3-year cumulative figures
Publication & Citation Trend
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Top 10 Most Cited Articles
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Frequently Asked Questions
What is the impact factor of Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP?
The official Journal Impact Factor (JIF) is published by Clarivate in the Journal Citation Reports (JCR) and is not listed on this page.
What is the H-index of Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP?
The H-index of Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP is 1, meaning 1 of its articles have each been cited at least 1 times.
Is Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP indexed in Scopus?
Yes. Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP is active in Scopus (Scopus Source List, August 2026).
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