32,907+ Journals Indexed Journal Suggester  |  Compare Journals
Home Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP

Proceedings of the Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP

Journal
Country
United States
Northern America
Subject Area and Category
Engineering
Control and Optimization
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
SJR 2025
N/A
H-Index
1
Total Docs. (latest)
24
Publication type
Journals
ISSN
28368487, 27681874
Coverage
2025
Journal Rank
#32,085

Subject Categories

Control and Optimization
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Safety, Risk, Reliability and Quality

Detailed Metrics

Total Docs. (latest) 24
Total Refs. 280
Ref. / Doc. 11.67
% Female 24.5%

Metrics Visualization

Latest year data vs 3-year cumulative figures

Publication & Citation Trend

Loading trend data from Crossref...

Data sourced from Crossref

Top 10 Most Cited Articles

Loading articles...

Recent Research Papers

Loading recent papers...

Journal Information

H Index1
ISSN28368487, 27681874
PublisherInstitute of Electrical and Electronics Engineers Inc.
CountryUnited States
RegionNorthern America
Coverage2025
Open AccessNo
TypeJournal
Rank#32,085

Similar Journals

View all Engineering journals

Embed This Journal

Add this journal's ranking badge to your website:

<iframe src="https://researchjournalrank.com/widget.php?id=32804" style="border:1px solid #e0e0e0;border-radius:8px;width:100%;max-width:320px;height:200px" frameborder="0"></iframe>
Preview: